PCB Design Company in Bangalore: Techlabs Semiconductor

Techlabs Semiconductor is a leading PCB design company in Bangalore, India, providing end-to-end semiconductor design and development services for the electronics industry. As one of the top chip design companies in India, Techlabs Semiconductor specializes in everything from integrated circuit (IC) design and verification to full system and printed circuit board (PCB) design. Our team of
industry veterans and skilled engineers delivers advanced semiconductor engineering solutions. These include ASIC and FPGA development, SoC design, post-silicon validation, and design for testability (DFT), all aimed at ensuring high-performance, reliable products. Based in India’s technology hub of Bangalore, Techlabs Semiconductor combines deep technical expertise with an innovation-driven approach to help clients bring cutting-edge electronic products to market faster.

Comprehensive Semiconductor Design Services in India

Techlabs Semiconductor offers a full spectrum of semiconductor design services in India, acting as a one-stop partner for complex electronics projects. We cover the entire semiconductor design process, from initial concept and system architecture to logic design, verification, and prototyping. Our experts handle everything from RTL coding and chip floorplanning to physical design implementation and static timing analysis (STA). We even support design for manufacturability and partner with semiconductor device fabrication companies during tape-out, ensuring a smooth transition from design to silicon.

As a comprehensive semiconductor services company, Techlabs Semiconductor goes beyond just chip design. We also provide system-level engineering, including board-level hardware integration and embedded & firmware design, to deliver end-to-end product design solutions. Our team’s diverse expertise spans analog and mixed-signal circuit design, power management, and reliability engineering. Whether it’s a custom ASIC, an FPGA- based prototype, or a complex System-on-Chip (SoC) for AI and IoT applications, we ensure each project adheres to industry best practices and quality standards. By offering semiconductor design and development services under one roof, we help clients accelerate their time-to-market while maintaining strict quality and performance benchmarks.

Expert PCB Design and System Design Services

Printed Circuit Board design is a critical aspect of system development, and Techlabs Semiconductor stands out as a PCB design company that delivers high-quality results. Our PCB design services cover the complete board development cycle, from schematic capture and component selection to PCB layout, fabrication support, and board bring-up. We excel at designing complex multilayer PCBs for advanced semiconductor devices, ensuring proper high-speed routing, impedance control, and robust power delivery networks. Every board is engineered with careful attention to signal integrity (SI), power integrity (PI), and electromagnetic compatibility, preventing issues like crosstalk or interference in high-frequency designs. We also leverage strong ECAD-MCAD integration to make sure the PCB design aligns with mechanical constraints and enclosure requirements.

As a leading PCB design company in India, Techlabs Semiconductor follows industry best practices and standards (IPC guidelines) to achieve reliable, manufacturable designs. We incorporate design for manufacturability (DFM) and design for testability (DFT) principles so that the final board is not only optimized for performance but also easy to produce and validate. Our engineers conduct thorough SI/PI & thermal analysis on critical boards, identifying any potential signal distortion or heat dissipation issues early in the design phase. This proactive approach results in boards that meet compliance standards (such as FCC, CE, or MIL standards) on the first pass, saving our clients time and cost.

Key PCB Design Capabilities at Techlabs Semiconductor:

High-Speed & Mixed-Signal PCB Layout: Expertise in multi-layer board design, including analog and mixed-signal circuits, FPGA boards, and RF/high-speed interfaces, with meticulous trace routing and impedance control.
Signal Integrity & Power Integrity Analysis: Pre-layout and post-layout SI/PI simulations to ensure clean signal transmission and stable power delivery across the board. This reduces issues in high-frequency and high-density designs.
Thermal Management: Comprehensive thermal analysis and heat dissipation strategies (heat sinks, copper pours, airflow considerations) to maintain safe operating temperatures for all components.
DFM and DFT Compliance: Applying design for manufacturability and testability guidelines, such as proper component spacing, test point insertion, and adherence to PCB fabrication tolerances. This ensures the design can be mass-produced with minimal revisions and easily tested during production.

Our holistic approach to PCB and system design means we deliver boards that are ready for real-world applications, whether it’s an automotive embedded system requiring ISO 26262 functional safety or a telecommunications module needing rigorous testing. From concept to prototype and final validation, Techlabs Semiconductor’s PCB design team ensures every project is executed with precision and excellence.

ASIC, FPGA, SoC and Mixed-Signal Design Expertise

For processor design and system-on-chip (SoC) computing projects involving ASICs and FPGAs, Techlabs Semiconductor provides expert VLSI design teams to realize your product vision. Our ASIC and FPGA design expertise spans from architecture and RTL coding to verification and physical implementation. We offer ASIC design services for custom chip development, handling logic design, synthesis, place-and-route, and timing closure using state-of-the-art EDA tools. In parallel, our FPGA design services enable rapid prototyping and validation on hardware, utilizing devices from leading FPGA vendors to emulate and test your system before committing to silicon. Our engineers can also transition an FPGA prototype to an ASIC (FPGA to ASIC conversion) when you need higher performance or volume production, ensuring a smooth path from concept to custom chip.

Techlabs Semiconductor’s team includes skilled ASIC designers, FPGA designers, and SoC architects who have worked on a variety of complex semiconductor projects. We excel in mixed-signal design as well, integrating analog and digital circuitry such as ADCs, DACs, RF components, and processors on the same chip. This analog and mixed-signal circuit design capability allows us to develop SoCs for industries like telecommunications, automotive, and consumer electronics that require tightly integrated functionalities. Throughout the design cycle, we perform thorough functional verification (simulation) and even formal verification in VLSI for critical modules to catch bugs early. Additionally, we conduct full-chip SoC verification using advanced simulation and emulation techniques to ensure all integrated components work together seamlessly. Our robust design and verification process, coupled with static timing analysis and pre-silicon validation on FPGA platforms, ensures that each ASIC or SoC design will meet specifications and reliably function when fabricated.

Post-Silicon Validation, Verification and Testing

Verification and validation are critical steps in our development process to guarantee that a design will perform as intended. Techlabs Semiconductor’s verification team uses advanced simulation and verification methodologies to catch design issues early (pre-silicon), while our validation engineers ensure the finished silicon and system meet all requirements (post-silicon). We employ both functional verification (simulation-based testing of RTL and gate-level models) and formal verification techniques to mathematically prove the correctness of critical logic. This rigorous pre-silicon verification, including RTL verification and static timing analysis, minimizes the risk of errors before fabrication.

Once the chip is fabricated or the PCB is assembled, our post-silicon validation experts take over. Post-silicon validation involves testing the actual hardware in real-world scenarios to verify that the semiconductor product meets its specifications and is free of defects. Our silicon validation engineers develop thorough test plans to exercise every functionality of the ASIC/SoC on evaluation boards and prototype systems. They use specialized lab equipment such as logic analyzers, oscilloscopes, and automated test setups to perform silicon bring-up, debug issues, and measure performance. We validate everything from basic functionality and power consumption to timing under various operating conditions, ensuring that the chip or system behaves reliably in the field. For each project, a dedicated post silicon validation engineer oversees the bring-up and testing process to guarantee final chip quality and compliance.

Techlabs Semiconductor also provides extensive semiconductor testing and reliability analysis services. We perform stress testing and reliability testing (temperature cycling, humidity, vibration, etc.) to gauge the robustness of our designs over time and under extreme conditions. For safety-critical projects (e.g., automotive or aerospace), our team conducts rigorous validation aligned with functional safety standards like ISO 26262. We ensure compliance with relevant industry standards and regulatory requirements, including EMI/EMC certifications and environmental tests. By integrating verification and validation across the entire development lifecycle, Techlabs Semiconductor achieves first- silicon success and high-quality products for our clients.

Functional Safety and Compliance (ISO 26262 & DO-254)

In safety-critical domains like aerospace and automotive, Techlabs Semiconductor provides specialized design and verification services to meet stringent compliance standards. We are well-versed in the DO-254 standard (RTCA DO-254, often written simply as DO 254 or DO254) for airborne electronic hardware. Our engineers follow a structured DO-254 process, covering everything from planning and requirements capture through design implementation, verification, and validation to ensure every project can achieve DO-254 certification. We prepare the necessary documentation (plans, design
data, verification reports) and perform thorough reviews and testing as required by the standard. Techlabs Semiconductor ensures DO-254 compliance by implementing best practices such as requirements traceability, hardware- software integration testing, and robust configuration management throughout the project lifecycle.

For automotive and other industries, we address functional safety requirements by adhering to ISO 26262 standards. ISO 26262 provides a framework for designing automotive electronics that can detect and safely handle faults. Our team incorporates functional safety analysis into the design, including Failure Modes and Effects Analysis (FMEA) and Fault Tree Analysis (FTA), to identify and mitigate potential risks. We design and verify safety mechanisms (such as watchdog timers, redundancies, and built-in self-tests) to achieve the required Automotive Safety Integrity Level (ASIL) for a given project. By aligning our development process with ISO 26262 and other relevant safety standards, Techlabs Semiconductor helps clients deliver reliable, safe electronics in vehicles, aerospace systems, and other mission-critical applications.

Innovation with AI in Semiconductor Design

Techlabs Semiconductor stays ahead of the curve by leveraging artificial intelligence (AI) and machine learning in our engineering workflows. AI in the semiconductor industry is revolutionizing how chips are designed and tested, and we integrate these cutting-edge techniques to benefit our clients. For instance, our team uses machine learning algorithms to optimize complex design parameters, predict potential failure points, and accelerate verification processes. By analyzing vast design datasets, AI can identify patterns (such as timing violations or layout hot-spots) faster than traditional methods, allowing our engineers to make proactive improvements. This AI-driven approach leads to more efficient design iterations, better optimization of power/performance, and reduced time-to-market for semiconductor products.

Beyond using AI as a tool, Techlabs Semiconductor also engages in semiconductor design projects related to AI and advanced computing. We provide Semiconductor AI services that include designing custom AI accelerators, neural network processors, and edge AI hardware solutions. Our expertise in AI semiconductor design means we understand the unique requirements of high-performance computing, such as parallel processing architectures, specialized memory subsystems, and thermal considerations for dense compute workloads. Whether it's implementing AI algorithms on
FPGA/ASIC platforms or optimizing a chip for machine learning tasks, Techlabs Semiconductor helps clients harness the power of AI both in the design process and through innovative silicon solutions.

Why Choose Techlabs Semiconductor?

Techlabs Semiconductor offers a unique combination of technical expertise, industry experience, and customer focus that sets us apart in the semiconductor design services landscape. Why partner with Techlabs Semiconductor? Here are a few key reasons:

Comprehensive, End-to-End Solutions: We provide complete support from initial concept through design, prototyping, validation, and even production liaison. This end to end product design capability means clients can rely on us for every step, reducing the need for multiple vendors.
Skilled & Experienced Team: With over 25 years of combined industry experience (including the backing of our parent company), our team of experts includes veteran ASIC architects, FPGA designers, post-silicon validation engineers, DFT specialists, and more. We bring deep knowledge and a proven track record to each project.
Innovation and Advanced Technology: We embrace the latest tools and methodologies, from AI-driven design optimization to cutting-edge EDA software, to deliver superior results. Our innovation-driven approach ensures that clients benefit from modern techniques like formal verification, AI algorithms, and emulation/prototyping services that de-risk the development process.
Quality, Safety & Compliance: Quality is paramount at Techlabs. We adhere to strict design and verification processes to achieve first-pass silicon success. Every project is executed with attention to reliability and safety standards, whether it's meeting DO-254 and ISO 26262 requirements or implementing thorough design for testability and static timing analysis checks. Clients can trust in our commitment to delivering robust, compliant solutions.
Bangalore Advantage & Global Delivery: Located in Bangalore, India’s Silicon Valley, we have access to a vast pool of engineering talent and a rich ecosystem of semiconductor companies. This allows us to scale quickly and remain cost-effective. We work seamlessly with global clients, combining the Bangalore advantage (innovation and cost efficiency) with clear communication and on-time delivery to customers worldwide.

Frequently Asked Questions

What is PCB?

PCB stands for Printed Circuit Board. It is a flat board made of non-conductive material (typically fiberglass epoxy laminate) that supports and electrically connects electronic components using conductive tracks, pads, and other features etched from copper sheets. In simpler terms, a PCB is the "backbone" of electronic devices, providing the physical platform on which chips and components are mounted and interconnected. PCBs can range from single- layer boards to complex multi-layer designs used in advanced electronics.

Define verification and validation in semiconductor design.

In semiconductor design, verification and validation are two related but distinct concepts. Verification is the process of checking that a design meets its specified requirements before manufacturing, for example, through simulations, formal proofs, or reviews (this stage is often called pre-silicon verification). It answers the question, “Did we design the chip right?” Validation, on the other hand, is the process of confirming that the manufactured hardware (silicon or system) works correctly and fulfills its intended purpose in the real world. This usually involves testing the physical chip or system (post-silicon validation) to answer the question, "Did we design the right chip?" Both verification and validation are essential: verification catches design errors early, while validation ensures the final product performs as expected.

What is DO-254 compliance?

DO-254 compliance refers to adhering to the DO-254 standard, which is a guideline for the development of airborne electronic hardware (used in aviation and aerospace). To be DO-254 compliant, a project must follow a rigorous hardware development process with defined stages such as requirements capture, design, implementation, and verification, along with comprehensive documentation and reviews at each stage. Achieving DO-254 compliance means the hardware design has met all the objectives of the standard (for its given Design Assurance Level) and is eligible for certification by aviation authorities. In practice, this ensures that the electronic hardware (like an avionic circuit board or ASIC) is reliable and safe for use in aircraft.

What is the difference between ASIC, SoC, and FPGA?

ASIC, SoC, and FPGA are all types of integrated circuits, but they serve different purposes and have key differences:

– An ASIC (Application-Specific Integrated Circuit) is a custom-designed chip created for a specific application or function. ASICs are fixed-function devices. Once manufactured, their logic cannot be changed. They are optimized for performance, power, and area for their specific task, making them very efficient (for example, a custom processor inside a smartphone or a chip that runs a specific algorithm).

– A SoC (System on Chip) is an integrated circuit that consolidates an entire system’s components into a single chip. A SoC typically includes a processor (or multiple processors), memory blocks, interface controllers, and other analog/digital IP cores on one chip. Essentially, a SoC can be thought of as a complete electronic system (like the core of a smartphone or IoT device) on one piece of silicon. Notably, a SoC may contain multiple ASIC modules and often some configurable logic (similar to FPGA blocks) along with embedded software, providing a full system solution on chip.

– An FPGA (Field-Programmable Gate Array) is a reprogrammable chip that contains an array of configurable logic blocks. Unlike ASICs, which are fixed, an FPGA can be programmed and reprogrammed after manufacturing to perform different functions. Engineers use FPGAs for prototyping digital designs or in applications where flexibility is needed, since the logic can be updated or changed via hardware description code. FPGAs generally have higher power consumption and lower speed compared to a dedicated ASIC, but their reconfigurability makes them invaluable for development, testing, and low-
volume or evolving applications.

In summary, the difference is that an ASIC is a custom fixed-function chip, a SoC is a single chip containing a full system’s functionality (often integrating processors, peripherals, and more on one die), and an FPGA is a flexible chip that can be reconfigured to perform various functions post-manufacturing.

What is the difference between formal verification and functional verification?

Formal verification and functional verification are two approaches to ensuring a design’s correctness. Formal verification uses mathematical methods (such as theorem proving or model checking) to exhaustively prove properties about a design. For example, formal tools can prove that for all possible inputs, certain safety conditions hold true in a hardware design. It does not rely on test vectors;
instead, it explores all possible states within given constraints. Functional verification, by contrast, usually refers to simulation-based testing. In functional verification, engineers create testbenches and test cases to simulate the design with many different inputs and scenarios, then check if the outputs match expected results. While simulation (functional verification) can cover a wide range of scenarios, it cannot test every possible case, so it is usually complemented by formal techniques for critical parts. In short, formal verification is exhaustive and proof-based, whereas functional verification
(simulation) is example-driven and ensures the design behaves correctly for a planned set of test scenarios.

What is post-silicon validation?

Post-silicon validation is the process of testing and verifying a semiconductor device after it has been manufactured (i.e., after the silicon chip is produced). Once a chip comes back from the foundry, engineers perform post-silicon validation by running the chip on evaluation boards or in system prototypes to ensure it functions as intended in real-world conditions. This stage involves checking that the silicon meets all specifications, has no manufacturing- induced issues, and works reliably across different voltages, temperatures, and use cases. Post-silicon validation complements pre-silicon verification (which is done via simulation and emulation) by catching any issues that could not be anticipated before fabrication. It often includes testing for performance, power consumption, signal integrity, and long-term reliability. The goal is to identify and fix any remaining problems before the product is released or goes into mass production.

What is Design for Testability (DFT) in VLSI?

Design for Testability (DFT) in VLSI refers to designing integrated circuits in such a way that they are easier to test for manufacturing defects and functional correctness. DFT techniques involve adding certain features or structures to the hardware that improve the controllability and observability of internal nodes. Common DFT implementations include adding scan chains (which allow serial shifting of test data into and out of internal flip-flops), built-in self-test (BIST) circuits (where the chip can test its own functionality using on-chip pattern generators and checkers), and boundary scan (JTAG) logic for testing interconnects on circuit boards. By incorporating DFT during the design phase, engineers ensure that once the chip is fabricated, it can be thoroughly tested using automated test equipment (ATE) to detect any faults. Effective DFT reduces the time and cost of testing and increases overall product yield, because defective chips can be identified (and potentially diagnosed) more
efficiently during production testing.